Devcon Aluminum Putty F

Devcon Aluminium Putty F

Description: Devcon Aluminium -filled epoxy putty for dependable non rusting repairs to aluminium castings, machinery, and equipment widely used in HVAC applications.

Intended Use : Devcon Aluminium Putty is a Patch for aluminium castings; make jigs, dies, and holding fixtures.

Product features: Devcon Aluminium Putty Can be machined, drilled, or tapped using conventional metalworking tools Bonds to aluminium, concrete, and many other metals Fills voids or pores in castings.

Limitations: Devcon Aluminium Putty is Not recommended for long term exposure to concentrated acids and organic solvents.

Typical Physical Properties: Technical data should be considered representative or typical only and should not be used for specification purposes Cured 7 days 75 Degrees Fahrenheit.
Mix Ratio by Volume - 4:1�Mix Ratio by Weight - 9:1�% Solids by Volume - 100�Pot Life 75degrees 60 min�Specific Volume 17.5 in. (3) /lb�Temperature Resistance Wet: 120F; Dry: 250degrees
Coverage/lb - 70 sq.in. /lb. 1/4"�Cured Hardness - 85D
Coefficient Degrees Fahrenheit Thermal Expansion�- 29 [(in.)/(in). x F)] x 10(-6)
Thermal Conductivity 1.73 [(Cal x cm)/(sec x cm(2) x C)] x 10(-3)
Cure Time�- 16 hrs
Recoat Time�- 10 -12 hrs
Mixed Viscosity�- Putty
Test Conducted: Compressive Strength ASTM D 695
Cured Hardness Shore D ASTM D 2240
Dielectric Constant ASTM D 150
Modulus of Elasticity ASTM D 638
Cure Shrinkage ASTM D 2566
Adhesive Tensile Shear ASTM D 1002
Dielectric Strength, volts/mil ASTM D 149
Coef.of Thermal Expansion ASTM D 696
Flexural Strength ASTM D 790
Thermal Conductivity ASTM C 177
Application Instructions: Spread mixed material on repair area and work firmly into substrate to ensure maximum surface contact. Devcon Aluminium Putty F will fully cure in 16 hours, at which time it can be machined, drilled, or painted. FOR BRIDGING LARGE GAPS OR HOLES Place fiberglass sheet, expanded metal, or mechanical fasteners between repair area and Devcon Aluminium Putty F prior to application.