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Invariance Semi-Automatic Solder Paste PCB Stencil Printer (INVSMT-1SSP)

₹ 2,20,000 Get Latest Price

Product Specifications

model	INVSMT-1SSP
Material	Iron
Power Requirement	500 W
Power Consumption	220 V AC
Air Supply	8 Bar
Printing Platform	320 mm by 420 mm
Printing Method	Automated
PCB Thickness Range	0.2 mm to 2.5 mm
PCB Placement: The operator manually places the bare Printed Circuit Board (PCB) onto the printer's adjustable printing platform.Alignment: The operator uses fiducial marks on both the PCB and stenci	mechanism automatically moves across the stencil, pushing the solder paste through the stencil's apertures onto the PCB pads.Stencil Separation (Snap-off): The machine automatically lifts the stencil
Power Supply	0.3KW, 220V AC
Printing Platform (Max PCB Size)	320 x 600 mm
Printing Precision	0.02mm
Production Capacity	100 kg/hr
Required Air Source	> 8 Bar Pressure Compressor (1-3 HP)
Squeegee Angle	60°
Squeegee Pressure Control	0.3 Bar
Squeegee Speed	20-50 mm/sec
Stencil Frame Size Compatibility	584 mm x 584 mm (23" x 23")
Stencil Separation Speed (Snap-off)	5 mm/sec
Typical Cycle Time	45 seconds
Alignment Adjustment Range	X-axis: 10 mm, Y-axis:10 mm, Theta (rotational): 5 deg;
Availability	In Stock
Brand/Make	Invariance Automation
Circuit Board Thickness	0.2 to 2.2 mm
Color	Offwhite
Control System	STM32 based Microcontroller with 12864 LCD Display
Machine Dimensions (L x W x H)	800 X 800 X 1400 mm
Machine Repeated Accuracy	0.05 mm
Material Composition	solder powder and flux
Minimum Spacing	0.25mm
Model/Type	Semi-Automatic
Net Weight	95 KG

Invariance Automation

GST No - 09AAFCI7462N1ZW | Member since 2025

369, Chandel Gate, Nankari,IIT KANPUR, Kalyanpur, Kanpur, Kanpur Nagar, Uttar Pradesh, 208016

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Product Details

The INVSMT-1SSP Semi-Automatic Solder Paste Printer from Invariance Automation is the cornerstone of any modern Surface Mount Technology (SMT) assembly line. In an industry where precision is paramount, this machine provides the perfect synergy of operator control and automated consistency. It is engineered to deliver flawless, repeatable solder paste deposition, directly translating to higher yields, reduced rework, and superior end-product quality for your customers.

This CE-certified printer is a reliable, high-performance solution for manufacturers looking to scale up from manual processes or require a flexible and cost-effective solution for small to medium-volume production runs. Backed by a comprehensive 1-year limited warranty covering parts and labor against defects in materials and workmanship.

PCB Placement: The operator manually places the bare Printed Circuit Board (PCB) onto the printer's adjustable printing platform.

Alignment: The operator uses fiducial marks on both the PCB and stencil to precisely align them (X, Y, and rotational adjustments).

Solder Paste Application: Solder paste is manually applied across the top edge of the stencil.

Printing Stroke: The machine's squeegee

mechanism automatically moves across the stencil, pushing the solder paste through the stencil's apertures onto the PCB pads.

Stencil Separation (Snap-off): The machine automatically lifts the stencil slowly and precisely away from the PCB.

PCB Removal: The operator manually removes the now-printed PCB.

Ready for Next Cycle: The machine is ready for the next PCB to be placed.

GST Number	09AAFCI7462N1ZW
Year of Establishment	2020
Nature of Business	Manufacturer of PCB Assembly Machines
Number of Employees	1 - 50
Turnover	40
Legal Status	Private Limited Company