Ansys Q3D Extractor Software (1 Year License for Windows)

Service Details

ANSYS Q3D Extractor: ANSYS simulation technology enables you to predict with confidence that your products will thrive in the real world. Customers trust our software to help ensure the integrity of their products and drive business success through innovation. Parasitic extraction tool for electronics design: Calculates the parasitic parameters of frequency-dependent resistance, inductance, capacitance and conductance (RLCG) for electronic products. 3-D solid modeling: A full-featured 3-D solid modeling tool can import or create arbitrary 3-D electronic structures, such as connectors, vias, wire bonds, solder balls,signal traces, and power and ground planes. Power- and signal-integrity analysis:  Apply extracted data in studying crosstalk, ground bounce, interconnect delays and ringing, as well as to understand performance of high-speed electronic designs — such as multi-layer printed circuit boards, advanced electronic packages and 3-D on-chip passive components.  Review the per bump R, L, G, & C parasitics of a package or die along with per cell R, L, G, & C of a Touch Panel/Screen. Q3D Extractor is ideal for designing advanced electronics packages and connectors used in high-speed electronic equipment or high-power bus bars and power converter components used in electrical power distribution, power electronics and electric drive systems. Solver Technology: Quasi-static 3D electromagnetic field analysis using Method of Moments accelerated by Fast Multipole Method DCRL, ACRL & CG Solver Quasi-static 2D electromagnetic field analysis using Finite Element Method Extraction Types: IC Packaging RLCG IBIS Extraction for Signals & Power Touch panel RLCG Unit Cell Extraction Bus Bar RLCG Extraction Power Inverter & Converter Component Extraction Specialized Thin Plane Solver for Touch Panel Extraction Meshing Technology: Automatic, Adaptive Mesh Refinement Automation: SPICE Equivalent Modeling Export 2D Transmission Line Modeling Toolkit 2D Cable Modeling Toolkit 3D Component Library Macro-modeling (Network Data Explorer) High Performance Computing: HPC Acceleration for DCRL, ACRL, and CG. Multiphysics: DCRL & ACRL Joule Heating Analysis with Icepak