Boron Nitride Plates

Product Details

Boron Nitride Plates are availabe as per the customer drawings in four material grades as given below.Four Material GradesGrades HBC and HBT are our highest purity hot-pressed boron nitrides. They are diffusion bonded and feature a low dielectric constant, minimal moisture pick-up and low loss tangent making them ideal for electronic applications.Grade HBT, although lower in strength and density than HBC, is available at lower cost and shorter lead times. Grade HBN uses small amounts of boric oxide as a binder; it is used in applications where hydration and thermal shock are not a concern. Grade HBR uses calcium borate as a strengthening binder and is moisture insensitive.For applications demanding even higher strength and durability, Momentive offers grade BIN77 composite material; see publication 81520 for more details.Thermal Management of Electronic DevicesThe unique combination of electrical resistivity and thermal conductivity makes BN an ideal heat sink in high power electronic applications. Its properties compare favorably with beryllium oxide, aluminum oxide and other electronic packaging materials, and it is easier to form and finish.High Temperature ApplicationsTemperature stability and excellent resistance to thermal shock make BN the material of choice in the toughest high temperature applications such as plasma arc welding and semiconductor processing.Molten Metal HandlingBN is inorganic, inert and is not wet by most molten metals and slags, nor does it react with halide salts or other reagents. These characteristics, combined with low thermal expansion, make it ideal for interface materials used in various molten metal processes.Markets Delhi, Mumbai, Kolkata, Chennai, Bangalore, Pune , Ahmedabad, Vadodra,Surat, Vapi, Aurangabad, Kohlapur, Raigad, Raipur, Lucknow, Jaipur, Udaipur, Trivandrum, Coimbatore, Bhopal, Gurgaon, Raipur, Manesar, Bhubaneshwar, Jamshedpur, Hyderabad, Vizag, Vijayawada, Goa, Hosur, Nagpur, Rajkot, Kanpur, India