Q. What are the two types of etching?
A.Etching comes in two primary forms: wet plus dry. Wet etching employs liquid chemicals, for example, acids or bases next to takes away substance from the surface. The process acts isotropically. It gets rid of the material evenly in every direction. This trait fits applications like wafer cleaning or substrate preparation. Frequent chemicals in wet etching include hydrofluoric acid and nitric acid. Dry etching works with gases or plasmas inside a vacuum chamber to eliminate substance. Because it is anisotropic, dry etching gives close command of the etch shape plus depth. For instance Reactive Ion Etching (RIE) and Ion Beam Etching (IBE) exist as dry etching ways. This type gets priority for applications that require high accuracy. Examples are microfabrication of electronic parts or complex designs. Although both ways perform functions based on needed exactness and the material traits.
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