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Reflow Oven in Sagar
(11 products available)Upgrade your production line with a high-performance Reflow Oven in sagar. Designed for consistent PCB soldering, these units support demanding business and industrial applications with precise temperature control and uniform heating. Source a Reflow Oven in sagar from trusted suppliers, manufacturers, dealers, or wholesalers offering verified quality standards. Enjoy competitive pricing, reliable after-sales support, and fast availability across sagar to keep operations efficient and output stable. Read more
Reflow Oven Products, Price, Specifications & Features in Sagar
Star Performer
Reflow Oven T-960
₹ 1,35,000
Get Best Price| Brand : Indoe |
| Condition : New |
| Machine Type : Semi-Automatic |
| Model Name/Number : T-960 |
₹ 48,000
₹ 63,000
Reflow Oven
₹ 1,25,000
Get Best Price| Input Voltage : 440V |
| Input Voltage : 440V |
| Model Name/Number : MODEL - YMS-FC-5500-TT |
| model : Reflow Oven |
Deals in Sagar, Madhya Pradesh
Model Name/Number: REFT022 Table Top SMT Reflow Oven, Automatic
₹ 95,000
Get Best Price| Automation Grade : Automatic |
| Brand : Ravindra Electronics |
| Country of Origin : Made in India |
| Input Voltage : 230V |
Model Name/Number: KE-Ws-200 8 KW Wave Soldering Machine KE-200DS
₹ 4,50,000
Get Best Price| Brand: imported |
| Air Pressure : 6BAR |
| Automatic Grade : Automatic, Semi-Automatic |
| Automation Grade : Automatic |
| Automation Grade : Semi Automatic |
₹ 7,00,000
₹ 4,50,000
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Desktop Reflow Oven
| Availability : In Stock |
| Cooling zone number : 2 natural air cooling |
| Country of Origin : Made in India |
| Heat method : Hot Wind |
₹ 3,50,000
962 A Reflow Ovenn T-962A
₹ 35,000
Get Best Price| Brand: Puhui |
| Air-Flow Direction : Horizontal Air Flow |
| Automation Grade : Semi-Automatic |
| Availability : In Stock |
| Brand : Puhui |
Model Name/Number: ERO-500 Conveyor Reflow Oven, 14.5 kW
₹ 9,00,000
Get Best Price| Air-Flow Direction : Horizontal Air Flow |
| Automation Grade : Automatic |
| Brands : ERO |
| Conveyor : Edge Conveyor |
Digital Reflow Ovens
₹ 13,000
Get Best Price| Availability : In Stock |
| Brand : Kerone |
| Dimensions : 150*90*65cm |
| Display : Digital |
Mini Reflow Oven, Automatic
₹ 15,000
Get Best Price| Automation Grade : Automatic |
| Brand : VHRC |
| Country of Origin : Made in India |
| Display Type : Digital |
Reflow Oven Conveyorized – 6 Zone
₹ 6,90,000
Get Best Price| Dimensions : 3,800 mm × 900 mm × 1,650 mm |
| Heating Zone Length : 2,400 mm |
| Heating Zone : 6 Top + 6 Bottom |
| Weight : 1,400 kg |
Top Reflow Oven Manufacturer and Supplier in Sagar
Focustek Manufacturing Services Private Limited
GST No - 06AAACR0667B1ZU
Deals in Sagar, Madhya Pradesh
Frequently Asked Questions about Reflow Oven in Sagar
Which convection reflow oven is best for printed circuit board assembly?
Convection reflow ovens are the best choice for PCB assembly as they provide better temperature uniformity by forced hot air circulation, which is the main reason why they are far better than IR ovens for complex boards. For the majority of uses, the BTU Pyramax series with up to 12 zones, nitrogen compatibility, and very accurate profile control for the high-volume production of smartphones and automotive electronics is a product that really stands out. It can very well reflow large boards (457x457 mm max) up to 220260C peaks. The Heller 1936 MK7 is a very good option for a mid, to, high throughput plant. It features multi-zone convection, vacuum options to eliminate voids, and an energy, efficient designjust what is needed for lead-free soldering in telecom or medical devices. The Rehm VXC Vacuum is a perfect solution for high-reliability requirements such as aerospace by integrating convection with a vacuum for the creation of defect-free joints on densely populated assemblies. The best decision largely depends on your scale: BTU for volume and Heller for versatility. Dont forget to preselect the number of zones (8+), conveyor speed, and IPC, compliant profiling.
How to calculate reflow oven cycle time?
The formula to determine the reflow cycle time for the PCA assembly process is ::: Cycle Time (sec) = (Heated Tunnel Length / Conveyor Speed) * 60, with the process dwell time taken into account. First of all, you have to determine - how much dwell time is necessary in the total seconds in the heated zones. Definitely, you have to add the time for the preheat phase (90150s), the soak phase (60120s), and the reflow phase (3090s), thus ensuring the time above the liquidus temperature between 172560C and 4590s. A total time required for the 4, min profile would be to aim for 240 total seconds. The heated length of the oven, for example, at 310m, needs to be determined from the specifications. You have to determine the conveyor speed, with cm/min speed determined by throughput as follows: Speed = (Board Length Boards/min Load Factor) / Dwell Time. For example, with the board length at 20 cm, the Boards per minute at 3, and the Load Factor at 0.8, and the dwell time at 4 min, the Speed becomes at 30 cm per minute. You have to check with the thermocouples, wherein the cycled time needs to be the same as the profile.
What is a convection reflow oven used for?
A convection reflow oven is essentially the electronics manufacturing industry's answer to precision in surface-mount technology (SMT) soldering of components to printed circuit boards (PCBs). With the aid of fans, it continuously circulates hot air to achieve uniform heating of the entire board during the reflow process, which is the actual melting of the solder paste resulting in the formation of reliable electrical joints. The use of this technique is outstanding in the large-scale production of consumer electronics like smartphones and laptops, automotive ECUs, telecommunications gear, and medical devices, to name a few, where the consistency of temperature is what keeps defects such as cold joints or component damage at bay. Compared to infrared ovens, convection ovens provide improved profile control for lead and lead-free solder and are therefore better suited for use on dense boards. Convection ovens also allow for multi-zone (preheat, soak, re-flow (220260C), cool) operations, resulting in ideal results for those manufacturing products that need to be miniaturised and dependable. In addition, they also provide excellent temperature profile control.
How to use a reflow oven?
A reflow oven is an essential piece of equipment in electronics manufacturing that helps to solder surface, mount components on PCBs by using a controlled heating process. The process begins with the preparation of the PCB: solder paste is applied to the pads through a stencil, and components are placed using a pick, and, place machine. The assembled board is thereafter positioned on the conveyor belt or tray of the oven. The temperature profile is defined via the control panel and generally comprises the stages: preheat (150, 180C), soak (180, 220C), reflow (220, 260C), and cool (rapid drop to ambient). An oven that has been preheated and whose zones are stable is a condition that must be met without fail. The board is moved through the zones at the right speed (e.g., 0.51.5 m/min for inline ovens). Thermocouples are used to monitor the profile. Solder joints are inspected for defects such as bridges or cold solder by AOI or X, ray after the board has been removed. If necessary, flux residues are cleaned and then the PCB is tested electrically.
How many types of reflow ovens are there?
Reflow ovens are available in several main types, each suitable for different production scales and requirements in the electronics manufacturing industry. Batch or tabletop ovens are small enough to be used for prototyping and small runs, and are capable of handling a single PCB that is loaded manually. Conveyorised ovens, which are the most common, use a belt to move boards through multi, zone tunnels for high-volume SMT lines. Infrared (IR) ovens heat a single side of the board by radiation from ceramic elements, thus allowing a very fast warmup, but the heating is less uniform. Convection ovens take care of the temperature by circulating the hot air with fans and are thus very precise and giving even temperature control and are therefore the best option for sensitive components. Nitrogen reflow ovens introduce inert gas to eliminate the possibility of oxidation hence the joints will be cleaner in lead, free soldering. Hybrid ovens have the ability to switch from IR to convection or vice versa, as well as combining the two technologies at the same time, thus making them very versatile. Vacuum reflow ovens ensure that the voids are removed from the solder for the highest reliability applications such as aerospace and medical. The selection depends on throughput, board size, and profile precision.
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